Specific Process Knowledge/Thin film deposition/Deposition of NiV/Sputtering of NiV in Wordentec
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NiV films made with different process parameters (Power and Pressure)
by Patama Pholprasit @nanolab in December 2016
Films made in the Wordentec.
Power[W] | Pressure [mbar] | NiV deposition rate [Å/s] | Roughness Ra by AFM [nm] | AFM image | SEM image | Comments |
---|---|---|---|---|---|---|
100 | 0.005 | 0.850 | 0.431 | |||
150 | 0.001 | 0.883 | TBD | TBD | TBD | Tested by Maksim Zalkovskij from NILT |
150 | 0.005 | 1.289 | 0.682 | |||
150 | 0.01 | 1.165 | 0.751 | |||
200 | 0.005 | 1.738 | 1.22 | |||
200 | 0.01 | 1.633 | 1.09 | |||
250 | 0.005 | 2.133 | 1.59 | |||
250 | 0.01 | 2.067 | 1.87 |
NiV deposition rate VS Sputtering power
The deposition rate of NiV film is strongly dependent on the sputtering power and from the graph below also shows that at lower sputtering pressure gives higher deposition rate.
The relation between deposition rate and the sputtering power at two sputtering pressure are :
- Deposition rate (at 0.005 mbar) = 0.008598*Power - 0.002111 [Tested at 100-250 watts]
- Deposition rate (at 0.01 mbar) = 0.009018*Power - 0.1821 [Tested at 150-250 watts]
NiV film roughness VS Sputtering power
NiV film roughness is highly dependent on sputtering power. The graph below shows that the roughness of NiV film is increased at higher sputtering power. On the other hand, the sputtering pressure does not have much influence on the film roughness.