Specific Process Knowledge/Thin film deposition/Deposition of NiV/Sputtering of NiV in Wordentec

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NiV films made with different process parameters (Power and Pressure)

by Patama Pholprasit @nanolab in December 2016

Films made by sputtering of a 6" target directly pointing at the substrate in the Wordentec (tool decommissioned 2025 but results may be of general interest).

Power[W]	Pressure [mbar]	NiV deposition rate [Å/s]	Roughness Ra by AFM [nm]	AFM image	SEM image	Comments
100	0.005	0.850	0.431	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
150	0.001	0.883	TBD	TBD	TBD	Tested by Maksim Zalkovskij from NILT
150	0.005	1.289	0.682	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
150	0.01	1.165	0.751	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
200	0.005	1.738	1.22	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
200	0.01	1.633	1.09	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
250	0.005	2.133	1.59	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016
250	0.01	2.067	1.87	AFM image of the NiV film surface on the Si substrate/ Dec 2016	SEM image of the cross section of NiV on the Si substrate/ Dec 2016

NiV deposition rate VS Sputtering power

The deposition rate of NiV film is strongly dependent on the sputtering power and from the graph below also shows that at lower sputtering pressure gives higher deposition rate.

The relation between deposition rate and the sputtering power at two sputtering pressure are :

Deposition rate (at 0.005 mbar) = 0.008598*Power - 0.002111 [Tested at 100-250 watts]
Deposition rate (at 0.01 mbar) = 0.009018*Power - 0.1821 [Tested at 150-250 watts]

Variation with Sputtering power of the NiV film deposition rate at the process pressure 0.005 mbar and 0.01 mbar/ Dec 2016

NiV film roughness VS Sputtering power

NiV film roughness is highly dependent on sputtering power. The graph below shows that the roughness of NiV film is increased at higher sputtering power. On the other hand, the sputtering pressure does not have much influence on the film roughness.