Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum

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Molybdenum deposition

Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

Sputtering of Molybdenum

Molybdenum may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("Sputter-System Metal-Oxide(PC1)" and "Sputter-System Metal-Nitride(PC3)"). See more in link here and the chart below.

Mo Sputtering in Sputter-System Metal-Oxide(PC1)

	E-beam evaporation (Temescal)	Sputter deposition (Lesker)	Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3))
General description	E-beam deposition of Mo (line-of-sight deposition)	Sputter deposition of Mo (not line-of-sight)	Sputter deposition of Mo (not line-of-sight)
Pre-clean	Ar ion source		RF Ar clean
Layer thickness	10Å to 600 nm *	10Å to 500 Å	10Å to at least 100 nm (discuss with staff)
Deposition rate	1Å/s to 10Å/s	Depends on process parameters, roughly about 1 Å/s	At least up to 4 Å/s. See process log.
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) Many smaller pieces	Pieces or 1x4" wafer or 1x6" wafer	Up to 10x4" or 6" wafers Many smaller pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8	Almost any as long as it does not outgas.
Comment		Sputter target size 2".	Sputter target size 3-4" (usually 3"). So far (June 2025) Mo has been deposited in PC1. See process log for details.

* Please send a request to us if you wish to deposit more than 600 nm (write to metal@nanolab.dtu.dk)