Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/isotropic/isoslow1

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
9/9-2014	6" First DUV box wafer	standard stepper mask (50 nm barc + 320 nm krf)	Si / 50%+	ICP Metal Etch / jmli	2*30 sec barc etch using 'slow etch with carrier'	danchip/jmlli/Si/isotropice/isoslow1 , 2:00 minutes	S005292