Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask

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Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned

• This information is save because it might be valuable as inspiration for other dry etch systems.

Etch of SiO2 using the recipe 1SIO2mbr with burned resist as masking material

Berit Geilman Herstrøm (BGE) from Nanolab@DTU

Process date: Before 2004 Recipe: 1sio2mbr Process time: ? min Mask: Burned resist Structure size on mask: 3 µm Etch rate ~120nm/min