LabAdviser/Process flow approval: Difference between revisions
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=== Why do process flows need to be reviewed === | === Why do process flows need to be reviewed === | ||
Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for | Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for cross-contamination. | ||
Process flows or any questions regarding process flow review should be submitted to '''process_flow@danchip.dtu.dk'''. | Process flows or any questions regarding process flow review should be submitted to '''process_flow@danchip.dtu.dk'''. | ||
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* '''Metal evaporation:''' Specify name of evaporator to use, process name, metal thicknesses and tolerances. | * '''Metal evaporation:''' Specify name of evaporator to use, process name, metal thicknesses and tolerances. | ||
* '''Wet/dry etch:''' specify name of etch/machine, process name, etch parameters and tolerances. | * '''Wet/dry etch:''' specify name of etch/machine, process name, etch parameters and tolerances. | ||
*'''Chemicals:''' if the process includes wet steps carried out in beakers it should be specified how to deposit used chemicals after use. | * '''Chemicals:''' if the process includes wet steps carried out in beakers it should be specified how to deposit used chemicals after use. | ||
You can download a template for process-flows here (word format): | |||
Revision as of 09:42, 18 March 2011
Process Flow Approval
Why do process flows need to be reviewed
Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for cross-contamination.
Process flows or any questions regarding process flow review should be submitted to process_flow@danchip.dtu.dk.
Recommendations to the setup of the process flow
- Process flow: Mark each page of the process flow with title, author, affiliation name, batch number and page number.
- Illustrations: Supply key process steps with illustrations of top layout and layer layout. If possible, mark the steps that carry a high risk of yield loss.
- Substrate: Specify the size, type and number of wafers to process and whether wafers should be processed differently.
- Photolithography: Specify the mask-name used for each photolithography step, and whether alignment should be performed to specific alignment marks. Specify aligner name, exposure dose, type of process (hard contact/soft contact), and the name of developer.
- Metal evaporation: Specify name of evaporator to use, process name, metal thicknesses and tolerances.
- Wet/dry etch: specify name of etch/machine, process name, etch parameters and tolerances.
- Chemicals: if the process includes wet steps carried out in beakers it should be specified how to deposit used chemicals after use.
You can download a template for process-flows here (word format):