Specific Process Knowledge/Lithography/Pretreatment

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Pretreatment

BHF dip

  • For substrates that are plain Si wafer: Give it 30s in the BHF + 5 min in water right before you spin resist on it. This removes the native oxide.

HMDS

  • For substrates with oxide, nitride and just for Si substrates in 6inch size the other option can be HMDS treatment in HMDS oven: use recipe 4.
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