Specific Process Knowledge/Thin film deposition/Deposition of Platinum

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Platinum deposition

Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (E-beam evaporator (Temescal) and E-beam evaporator (10-pockets))	E-beam evaporation (Wordentec)	Sputter deposition (Lesker)	Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3))
General description	E-beam deposition of Pt	E-beam deposition of Pt	Sputter deposition of Pt	Sputter deposition of Pt
Pre-clean	Ar ion etch (only in E-beam evaporator Temescal)	none	RF Ar clean	RF Ar clean
Layer thickness	10Å - 600nm*	10Å - 600nm*	10Å - 600nm*	10Å - ? discuss with staff
Deposition rate	0.5Å/s to 10Å/s	0.5Å/s to 10Å/s	up to 3.74 Å/s	not known yet, probably similar to 'old' Lesker system
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) smaller wafers and pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	1x4" wafer or 1x6" wafer smaller pieces	Up to 10x4" or 6" wafers Many smaller pieces
Allowed materials	Almost any that does not degas at your intended substrate temperature. See the cross-contamination sheet.	Almost any that does not degas. See the cross-contamination sheet.	Almost any that does not degas.	Almost any that does not degas at your intended substrate temperature. See cross contamination sheets for PC1 and PC3
Comment	Pt tends to exhibit tensile stress, see section on stress in thin films.

* If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.