Specific Process Knowledge/Back-end processing/Disco Saw

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Disco Automatic dicing saw, model DAD321 (old) and DAD3241 (new 2021)

The dicers feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.

The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty.

In general it is not allowed to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.

Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer. Please see the illustrations for a good and a bad design.


GOOD design - simple	GOOD design - complex	BAD design

GOOD design - simple	GOOD design - complex	BAD design
	drawings by Jesper Hanberg, DTU Nanolab

Process information

The user manual, user APV, technical information and contact information can be found in LabManager:
- DAD 321 Saw in LabManager
- DAD 3241 Saw in LabManager

Comparing dicing parameters for different materials
Images of diced samples
Dicing work sheet: Dicing Work Sheet v2.docx Fill out before requesting dicing.

Overview of the performance Disco DAD 321 and DAD 3241 Dicer

Machine	Name	DAD 321 (old)	DAD 3241 (new 2021)
Machine	Operation	Keyboard F-key menu driven BW screen	Touch screen Guided menu Color screen
Purpose	Main usage	Dicing Borofloat and Fused Silica wafers	Dicing Silicon wafers
Purpose	Wafer type	Pyrex/Borofloat Fused Silica Silicon bonded to Pyrex/Borofloat Silicon bonded to Silicon Other materials - ask Pure Silicon samples	Pure Silicon samples Pyrex/Borofloat Silicon bonded to Silicon Silicon bonded to Pyrex/Borofloat Other materials - ask
Performance	X-axis cutting range	192 mm	210 mm
	X-axis cut speed	0.1 - 300 mm/sec	0.1 - 800 mm/sec
	Y-axis cutting range	162 mm	210 mm
	Y-axis index step	0.0002 mm	0.0001 mm
	Y-axis single error	0.003 or less	0.002 or less
Substrates	Substrate size	up to 6"	up to 8"
Substrates	Layers that can't be diced	Thick metal (>0.75 mm) III-V samples	Thick metal (>0.75 mm) III-V samples
Accessories	Accessories for wafer handling	Manual wafer mounter for blue tape	Manual wafer mounter for tape with backside foil (Powatec P200) Automatic Wafer cleaning station (Disco DCS 1441) UV curing station (Powatec U200)

Comparing dicing parameters for different materials DAD 321

Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters

	Silicon	Pyrex or bonded Si/Pyrex
Bladetype	HUB Blade ZH05 (27HEEF)	HUBless Blade B1A862
Blade width	50 µm	150 µm
Cutlinewidth	60 µm	180 - 200 µm
Recommended feed speed	Up to 20 mm/sec	Up to 2 mm/sec (0.5 mm/sec)
Recommended dice depth	Set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm. It is possible to cut through the sample.	Do not cut deeper than 500 µm in each pass (for fused Silica and SiC 200 µm). If you have thicker wafers then use several passes decreasing the blade height for each pass. For 500 µm thick wafers set blade height to 200µm (preferred). This leaves 125µm uncut since blue tape is 75µm. It is possible to cut through the sample.
Max. sample thickness	1.5 mm	2.0 mm

Comparing dicing parameters for different materials DAD 3241

Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters

	Silicon	Other materials
Bladetype	HUB Blade	Ask! (HUBless)
Blade width	50 µm	ask
Cutlinewidth	50 µm	ask
Recommended feed speed	Up to 40 mm/sec	ask
Recommended dice depth	We usually cut all way through the wafer with a blade height of 50µm (preferred).	ask!
Max. sample thickness	1.5 mm	2.0 mm