Specific Process Knowledge/Lithography/Pretreatment/Oven 250C

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Revision as of 12:39, 7 February 2023 by Jehem (talk | contribs) (Created page with "=Oven 250C= 300x300px|thumb|Oven 250C for pretreatment in Cx-1 The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven. The user manual, and contact information can be found...")
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Oven 250C

Oven 250C for pretreatment in Cx-1

The oven is typically used for dehydration pretreatment, of Si and glass substrates, to promote the resist adhesion. We recommend placing the wafers in a metal carrier in the oven for at least for 4 hours, or overnight, and spin coat resist on them as soon as possible after removing them from the oven.


The user manual, and contact information can be found in LabManager:

Oven 250C - requires login

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