Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/Evaporation of W in Temescal

Deposition of W in Temescal

During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead.

Power 33W, stable rate, tooling 86%. Measured thickness 20 nm (XRR).

Wait for base pressure 3 10-7Torr before start.

Deposition of Tungsten. Dep. rate: 0.5Å/s, Thickness sp.: 20nm

Tooling factor 86% 2022-02-25 Layer name Thickness (nm) Density (g/cm3) Rougness (nm) Delta Beta Moisture 0.80 0.52 0.52 1.7906e-6 4.1579e-8 WOx 1.01 5.00 0.72 1.6991e-5 3.9456e-7 W 19.12 15.66 0.81 3.7045e-5 2.9324e-6 SiO2 (native oxide) 2.09 2.15 0.32 7.0136e-6 1.6287e-7 Si (wafer) $\infty$ 2.33 0.00 7.5860e-6 1.7616e-7

• XRR analysis of e-beam deposited Ta thin film.
• 
  X-ray reflectivity. Measurement and Fit. Tooling 86%. Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation