Specific Process Knowledge/Thin film deposition/Deposition of Silver/Sputter Ag in Wordentec

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Sputtering of Ag in the Wordentec

Depending on the settings (pressure and power) during the sputtering process, the uniformity and grain size of the deposited layer will be different.

The deposition rate will also change with these settings.

Pressure 10^-3 mbar, Power 150 W

The deposition rate in the Wordentec is established to be 0.5 Å/s (in the center of the wafer).

(Measured before July 2013, KNIL).