Specific Process Knowledge/Thin film deposition/Deposition of Gold/Roughness of Au

Uniformity of Au layers

There are several machines at Danchip that can be used to deposit Au. This page show the result of a study about the surface roughness of the Au layers deposited with different machines and parameters.

Experimental

Au was deposited directly on unprocessed Si wafers, and the deposited layers were thereafter examined with AFM.

The deposition parameters were changed, and different equipment was used. Below, AFM pictures of layers deposited with different parameters can be seen.

Results

The layer deposited in Wordentec is uniform, without any larger structures. Below a 2.5 x 2.5 mym large area of the surface is shown, the difference in hight between the lowest and tallest structure is about 7nm.

E-beam deposited Au layer; deposited in the Wordentec, rate 5 Å/s. The Au surface is uniform, without any large variations of the surface structure.