Specific Process Knowledge/Thin film deposition/Deposition of Copper/Deposition of Copper

Roughness of Cu layers

The roughness of Cu layers deposited in the Alcatel was examined by AFM measurements.

Experimental

Cr was deposaited in Alcatel, directly on unprocessed Si wafers. The deposition rate was 10 Å/s.

Results

There are differences in uniformity and grain size, for the various deposition methods. For the sputtering processes there are large differences depending on the settings during the process, i. e. Ar pressure and effect.

The Cu surface is rather un-uniform. Large grains, randomly distributed, can be seen on the film surface.

The largest grains can be upp to