Specific Process Knowledge/Thin film deposition/Deposition of Copper/Deposition of Copper

Uniformity of Cu layers

To Deposited layers of Cu was examined with AFM, to Cu have been deposited with both E-beam evaporation and sputtering deposition to examine if there are differences in the uniformity of the Cr layers.

Experimental

Cr depositions have been done directly on unprocessed Si wafers, all depositions has been done in Wordentec. The deposited layers have therafter been examined with AFM.

Results

There are differences in uniformity and grain size, for the various deposition methods. For the sputtering processes there are large differences depending on the settings during the process, i. e. Ar pressure and effect.

The Cu surface is rather un-uniform. Large grains, randomly distributed, can be seen on the film surface.

The largest grains can be upp to