Specific Process Knowledge/Thin film deposition/DiamondCVD

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SEKI Diamond CVD

The user manual(s), user APV(s), technical information, and contact information can be found in LabManager:

XRD SmartLab in LabManager

Equipment performance and process related parameters

Equipment		XRD SmartLab
Purpose	Crystal structure analysis and thin film thickness measurement	Phase ID Crystal Size Crystallinity Quality and degree of orientation 3D orientation Latice strain Composition Twist 3D lattice constant Thickness Roughness Density
X-ray generator	Maximum rated output	3 kW
	Rated tube voltage	20 to 45 kV
	Rated tube current	2 to 60 mA
	Type	Sealed tube
	Target	Cu
	Focus size	0.4x8 mm (Line/Point)
Goniometer	Scanning mode	incident / receiver coupled or independent
	Goniomenter radius	300 mm
	Minimum step size	0.0001° (0.36")
	Sample stage	χ:-5~+95° φ:0~360° Z:-4~+1 mm X,Y:±50 mm for a 100 mm wafer Rx,Ry:-5~+5°
	Sample size	Diameter: 150 mm Thickness: 0~21 mm
Optics	Incident side	Cross Beam Optics(CBO) Ge(220)x2 monochromator In-Plane Parallel Slit Collimator (PSC) Soller slit Variable divergence slit
	Receiver side	Automatic variable scattering slit Automatic variable receiver slit Parallel slit analysers (PSA) Ge(220)x2 analyser
Substrates	Substrate size	up to 150 mm wafers
	Allowed materials	All materials