Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Sputter rates for Al

Deposition rate

Depening on the settings (pressure and effect) during the sputtering process, the uniformity and grain size of the deposited layer will be different.

The deposition rate will also change with the settings.

Pressure $1*10^{-3}$ mbar, Effect 150 W

The rate is established to be 1.6 Å/s (in the center of the wafer, 1.4 Å/s at the edge).

This corresponds to a deposition time of 1 minute 4 seconds for deposition of 10 nm.