Specific Process Knowledge/Lithography/ARP617
Test of copolymer AR-P 617.05; a positive e-beam resist from AllResist. This copolymer is meant to be used as a sacrificial layer in a bi- or tri-layer e-beam resist stack (i.e. bottom layer). The copolymer adheres well on many substrates and can be dry-etched isotropically (to create under-cut) and anisotropically by reactive ion etch.
Spin Curve
The thickness is measured on VASE Ellipsometer using a simple Cauchy model for a transparent polymer on Si. The measurements are performed at one incidence angle (70 degrees) only.
9 points on each 4" wafer has been measured; the standard deviation thus representing the homogeinity of the film on the 4" wafers.
AllResist AR-P 617.05 spinning on Spin Coater: Manual LabSpin A-5, TIGRE, 13-06-2014 | ||||||
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Spin Speed [rpm] | Acceleration [1/s2] | Thickness [nm] | St Dev | |||
2000 | 2000 | 256.70 | 0.96 | |||
3000 | 2000 | 208.33 | 1.24 | |||
4000 | 2000 | 185.41 | 0.50 | |||
5000 | 2000 | 168.34 | 0.88 | |||
6000 | 2000 | 161.90 | 1.99 |