Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Sputter rates for Al

Deposition rate of Al sputtering in the Wordentec

Deposition rate of Al depends on the process parameters (power and pressure) during the sputtering process, the uniformity and grain size of the deposited layer will be different.

The deposition rate will also change with the settings.

Pressure 10^-3 mbar, Power 150 W

The rate is established to be 1.6 Å/s (in the center of the wafer, 1.4 Å/s at the edge).

(Measured October 2008, KNIL).