Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al

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Thermal evaporation of Aluminum

Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.

Recipe

Use process 9 in Wordentec to deposit thermal Aluminum.

Observe: you need to be specially trained to use the thermal deposition source.

Set-up

Two "boats" of Tantalum are mounted (on top of each other) in the thermal source each time.

If the last deposition from the source was Aluminum, the same boats can be used, otherwise they should be changed.

"Small" Al pellets (diameter 1/8", height 1/8") are used. Use these small to get a more uniform deposition with stable deposition rate.

Program settings

Deposition rate is normally 1 or 2 Å/s.

The settings saved in the material file for thermal aluminum are these:

Soak power 1: 5%

Soak power 2: 7%

These are already saved in the process.