Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al

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Thermal evaporation of Aluminum

Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.

Recipe

Use process 9 in Wordentec to deposit thermal Aluminum.

Observe: you need to be specially trained to use the thermal deposition source.

Program settings

The settings saved in the material file for thermal aluminum are these: Soak power 1: 5% Soak power 2: 7% These are already saved in the process.

There is a general page concerning different methods of depositing Aluminium at Danchip.