Specific Process Knowledge/Etch/DryEtchProcessing
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Techniques, hardware and challenges common to all dry etch tools
This page contains information that is common to dry etch instruments.
| Dry etch page | Description |
|---|---|
| Hardware comparison | Comparison of the different hardware setups |
| Temporary bonding | Processing different sizes of substrates by bonding to carriers |
| Optical Endpoint System | Using the OES technique to find endpoints and to diagnose plasmas |