Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBE process trends

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Some general process trends

This page is supposed to gather some general process trends and good advise for designing IBE recipes. So far these trends has been developed etching Si with resist as masking material and by etcing some multilayered films. The work has been done by Kristian Hagsted Rasmussen @ Nanotech

Etch rate

Etch rate Parameters
increases with Beam current
increases with Beam voltage
increases with Beam current * Beam voltage
not significantly effected by Stage angle
not significantly effected by Accelerator voltage


Etch profile

Etch profile (goal 90dg) Parameters
improves with Low stage angle (optimum around 5-10 dg)
is effected by Beam current (low I(B)(400mA) better than high I(B)(600mA))
is effected by Accelerator voltage * Stage angle
not significantly effected by Beam voltage


Rotation speed

The rotation is activated to get a good uniformity over the wafer. The minimum number of rotations to get a good uniformity is 100 rotations for the whole etch. the maximum rotation speed is 20rpm. That means that an etch shorter that 5 min cannot obtain a very good uniformity.

Etch Length [min] 5 6 7 8 9 10 15 20 25 34 50 100
Minimum rotation speed [rpm] 20 17 15 13 12 10 7 5 4 3 2 1