Specific Process Knowledge/Thin film deposition/Deposition of Silver/Sputter Ag in Wordentec

Deposition rate

Depending on the settings (pressure and effect) during the sputtering process, the uniformity and grain size of the deposited layer will be different.

The deposition rate will also change with the settings.

Pressure 10^-3 mbar, Effect 150 W

The rate is established to be 0.5 Å/s (in the center of the wafer).