Jump to content
Main menu
Main menu
move to sidebar
hide
Navigation
Main Page
TPT/Intro Courses
Training Videos
DTU Nanolab Projects
Cleanroom Naming and phones (B346)
Characterization Layout and phones (B314)
Nano Characterization B314/307
Overview DTU Nanolab – building 314/307
Microscopy
Preparation
Safety
Micro/Nano Fabrication B346/347
Pattern Design and Mask Fabrication
Back-end processing
Bonding
Characterization
Direct Structure Definition
Doping
Etch
Imprinting
Lithography
Thermal process
Thin film deposition
Wafer and sample drying
Wafer cleaning
Wafer information
Overview of Fume Hoods
contact
LabAdviser mailbox
Nanolab fabrication contact info
extras
Recent changes
Help
Editor Help
Search
Search
Log in
Personal tools
Log in
Contents
move to sidebar
hide
Beginning
1
THIS PAGE IS UNDER CONSTRUCTION
Toggle the table of contents
Specific Process Knowledge/Thin Film deposition/ALD/Al2O3 deposition using ALD
Page
Discussion
English
Read
View source
View history
Tools
Tools
move to sidebar
hide
Actions
Read
View source
View history
General
What links here
Related changes
Special pages
Printable version
Permanent link
Page information
From LabAdviser
<
Specific Process Knowledge
Revision as of 15:41, 19 February 2014 by
Pevo
(
talk
|
contribs
)
(
diff
)
← Older revision
|
Latest revision
(
diff
) |
Newer revision →
(
diff
)
THIS PAGE IS UNDER CONSTRUCTION
Al
2
O
3
thickness as function of number of cycles, temperature 300
o
C. Evgeniy Shkondin, DTU Danchip, February 2014.
Al
2
O
3
thickness as function of number of cycles, temperature 200
o
C. Evgeniy Shkondin, DTU Danchip, February 2014.
Toggle limited content width
