Specific Process Knowledge/Back-end processing

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Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.

These processes are usually carried out outside the clean room. At Danchip we have a laboratory called Packlab located in building 347 1.st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing.

Choose an equipment

• Chip/die mounting
  • Die Bonder (eutectic metal)
  • Flip-chip Bonder (glue)
• Wire bonding
  • TPT Wire Bonder
  • Ball Wire Bonder
• Wafer dicing/machining
  • Polisher/Lapper machine
  • Wafer Scriber
  • Disco Saw
  • Laser Micromachining Tool
  • Sandblasting (at DTU Nanotech).
• Molding
  • Polymer Injection Molder
• X-ray inspection system
  • Focal Spot X-ray system

Choose processing method

Lapping/polishing	Cutting	Milling	Die bonding	Wire bonding
Polisher/Lapper machine	Wafer Scriber Disco Saw Laser Micromachining Tool	Laser Micromachining Tool Nanotech milling lab	Die Bonder (eutectic metal) Flip-chip Bonder (glue)	TPT Wire Bonder Ball Wire Bonder

Choose material to be processed

Dielectrica	Semiconductors	Metals	Polymers
Borofloat glass (Pyrex) Fused silica (quartz)	Silicon III-V	Aluminium Nickel Steel	PMMA TOPAS Polystyrene Polycarbonate