Specific Process Knowledge/Thermal Process/BCB Curing Oven

BCB Curing Oven

The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metal in a nitrogen atmosphere.

During processing the furnace is rapidly heated by use of five halogen lamps below the sample. The furnace is purged with a controlable nitrogen flow. There is vacuum on the furnace.

The user manual, user APV, technical information and contact information can be found in LabManager:

The BCB Curing Oven. Located in the III-V Lab

BCB Curing Oven

Process information

There are no standard processes on the furnace.

Equipment performance and process related parameters

Equipment		Resist Pyrolysis Furnace
Purpose		Pyrolysis of different resist layers to form conductive structures
Process parameter range	Temperature	0-1000oC Temperature ramp-up rate: Max 10oC/min Temperature ramp-down rate: Relative slow (depending on the furnace temperature)
	Nitrogen flows	Flow 1: Max 660 liter/hour Flow 2: Max 3500 liter/hour
Substrates	Batch size	Several small samples (placed on Si support wafers) One-six 50 mm wafers (placed on Si support wafers) One-six 100 mm wafers
	Allowed materials	Silicon Silicon oxide Silicon nitride Quartz AZ resist (prebaked) SU-8 (prebaked)