Specific Process Knowledge/Thin film deposition/Deposition of Copper

Copper can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)
Batch size	Up to 1x4" wafers smaller pieces
Pre-clean	RF Ar clean
Layer thickness	10Å to 0.5µm
Deposition rate	2Å/s to 15Å/s

Studies of Cu deposition processes

Roughness of Cu layers - Roughness of Cu layers deposited with Alcatel