Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of silicon nitride using Lesker sputter system
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The sputter-system(Lesker) can be use to deposit silicon nitride by reactive sputtering with a gas mixture of Ar and N2, where N2 is the reactive gas.
We have little experience with this so any information you obtain will be welcome.
Recipes on Sputter-System(Lesker) for deposition of silicon nitride
Recipes
The recipe below has been tried in the system. It is possible to change many of the parameters.
| Recipe name | Target | Gun | Power [W] | Pressure [mTorr] | RF substrate Power [W] | Gas | Temperature | Deposition rate |
| source 3 DC with nitrogen | Si | 3 | 90 | 4 | 10 | Ar+45%N2 | RT | ~1.7nm/min |
| source 1 DC with RF bias and nitrogen | Si | 1 | 180 | 4 | No | Ar+45%N2 | RT | ~4.25nm/min |