Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope
Process optimization using the Picoscope
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
| Process A parameters | ||
|---|---|---|
| Step 2 | ||
| Parameter | Etch | Dep |
| Gas flow (sccm) | SF6 350 (1.5 s) 550 | C4F8 200 |
| Cycle time (secs) | 7.0 | 4.0 |
| Pressure (mtorr) | 25 (1.5 s) 150 | 25 |
| Coil power (W) | 2800 | 2000 |
| Platen power (W) | 140 (1.5) 45 | 0 |
| Cycles | 44 (vary this) | |
| Common | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers | |
- 4 cycles of Process A
-
Recorded with the SPTS software -
Recorded with the Picoscope
- 4 cycles of Process D4
-
Recorded with the SPTS software -
Recorded with the Picoscope
