Specific Process Knowledge/Characterization
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Overview of
' | Microscopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflectometer) | Ellipsometer | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester |
Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 3) | x | |||||||
Defects | x | x | ||||||||||||||
Wafer thickness | x 1) | x 1) | x | |||||||||||||
Step coverage | x 1) | x 1) | ||||||||||||||
Particles | x | x | x | |||||||||||||
Element analysis | x | x | x 4) | x 4) | ||||||||||||
Surface roughness | x | x | x | |||||||||||||
Deposition uniformity | x | x | x | |||||||||||||
Film stress | x | x | ||||||||||||||
Refractive index | x | x | ||||||||||||||
Reflectivity | x | x | (x) | |||||||||||||
Resistivity | x | |||||||||||||||
Breakdown voltage | ||||||||||||||||
electrical conductivity | x | |||||||||||||||
Thermal conductivity | ||||||||||||||||
Optical gap | x | x | ||||||||||||||
Crystalinity | x | |||||||||||||||
Charge carrier life time | x | |||||||||||||||
Contact angle hydrofob/hydrofil | x | |||||||||||||||
Hardness measure | x | |||||||||||||||
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
- Ellipsometer
- Filmtek 4000
- Prism Coupler
- PL mapper - Photoluminescence mapper
- Lifetime scanner MDPmap
SEM's at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S
SEM's at Danchip
TEM's at CEN
Various