Specific Process Knowledge/Thin film deposition/Deposition of Titanium Oxide

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Deposition of Titanium Oxide

Titanium oxide can be deposited only by sputter technique. At the moment the only system where we have a target for Titanium oxide is IBE/IBSD Ionfab300. The target is Ti. During the sputter deposition oxygen is added to the chamber resulting in Titanium oxide on the sample.

• TiO2 made on IBE/IBSD Ionfab300

Comparison of the methods for deposition of Titanium Oxide

	Sputter technique using IBE/IBSD Ionfab300	Sputter System Lesker
Generel description	TiO2 created from a Ti sputter target. By adding oxygen during the deposition TiO2 is created.	Reactive DC sputtering of Ti target in Ar/O2 (10% O2) plasma. RF sputtering of TiO2 target
Stoichiometry	Can probably be varied (sputter target: Ti, O2 added during deposition)	unknown
Film Thickness	~10nm - ~0.5µm(>2h)	~10nm - ~0.5µm(>2h)
Deposition rate	3.0-3.5nm/min (reactive DC sputtering)	3 - 5 nm/min (RF sputtering) 0.3 - 0.5nm/min
Step coverage	Not Known	Not Known
Process Temperature	Expected to be below 100oC	Done at RT. There is a possibility to run at higher temperatures
More info on TiO2	TiO2 made on IBE/IBSD Ionfab300
Substrate size	1 50mm wafer 1 100mm wafer 1 150mm wafer 1 200mm wafer Smaller pieces can be mounted with capton tape	several small samples several 50 mm wafers (Ø150mm carrier) 1x 100 mm wafers 1x 150 mm wafers
Allowed materials	Almost any materials not Pb and very poisonous materials	Almost any materials Pb and poisonous materials only after special agreement