Specific Process Knowledge/Back-end processing/Wire Bonder

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TPT Wire Bonder

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TPT Wire Bonder Building 346, 2nd floor

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.


  1. Wedge Bonding
Gold wire 25 my wire.
Alluminium wire 25 my wire.
Min. bonding area 200 my.
  1. Ball bonding
Ball bonding gives free choice of bonding direction. First bond forms a small ball and second bond is a wedge bond.
Gold only 25 my wire.
Min. bonding pad 300 my.
Sample withstand heating to 120 degree C.
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