Specific Process Knowledge/Back-end processing/Wire Bonder

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Revision as of 09:04, 21 January 2008 by 192.38.87.70 (talk) (New page: ==TPT Wire Bonder== Image:Example.jpg Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The T...)
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TPT Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder.

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