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09:51, 18 June 2015 Tigre talk contribs uploaded File:CHIPAL.jpg (MsUpload)
14:11, 17 June 2015 Tigre talk contribs uploaded File:E-beam Lithography Lecture Tine Greibe 2015 (4).pdf (MsUpload)
14:29, 10 June 2015 Bghe talk contribs deleted page Electroplating-Cu (content was: "= The mobile plating unit = The Mobile Plating-Unit includes a process unit necessary for the Cu-electroplating as well as a pump with display, tank, heating syste..." (and the only contributor was "Lynhen"))
10:32, 3 June 2015 Mdyma talk contribs uploaded a new version of File:IMG 6021.jpg
10:31, 3 June 2015 Mdyma talk contribs uploaded a new version of File:IMG 6021.jpg
10:27, 3 June 2015 Mdyma talk contribs uploaded File:IMG 6021.jpg
14:39, 2 June 2015 Bghe talk contribs uploaded File:Under etch.jpg (MsUpload)
14:39, 2 June 2015 Bghe talk contribs uploaded File:Si etch rate.jpg (MsUpload)
14:39, 2 June 2015 Bghe talk contribs uploaded File:Si etch angle.jpg (MsUpload)
14:39, 2 June 2015 Bghe talk contribs uploaded File:Line width.jpg (MsUpload)
14:39, 2 June 2015 Bghe talk contribs uploaded File:Resist etch rate.jpg (MsUpload)
12:33, 2 June 2015 Bghe talk contribs uploaded File:RIE2 Travka.pdf (MsUpload)
20:23, 1 June 2015 Rami talk contribs uploaded File:FEG.jpeg
20:11, 1 June 2015 Rami talk contribs uploaded File:MG 8882.jpg (DTU Cen's FEI Quanta 200 ESEM FEG)
13:31, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy/FEI/Detectors (content before blanking was: "=== Detectors on the FEI SEM=== The FEI SEM has 6 electron detectors and 1 photon (X-ray) detector. * ETD: In chamber SE Detector (Everhardt Thornley Detector) */TLD| TLD: Inlens SE detector (Through Lens Dete...")
13:30, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy/FEI/Detectors/ETD (content was: "The ETD detector is a standard HiVac detector of secondary electrons" (and the only contributor was "Jml"))
11:05, 1 June 2015 Bghe talk contribs deleted page E-beam lithography (content was: "#REDIRECT Specific Process Knowledge/E-beam lithography" (and the only contributor was "BGE"))
10:59, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/JEOL E-beam Writer (content was: "300x300px|thumb|JEOL E-beam writer: positioned in cleanroom 4 - the E-beam writer room The E-beam Writer is a lithography tool. The very short wavelength of 100 kV electrons makes it possible to focus an...")
10:57, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Spinning e-beam resist (content was: "Spinning e-beam resists demands some special precondition. First of all spinning and post backing must be done with the equipments placed in fume hood, which gives good exhaust. The cleanness of surroundings and the right behavior during...")
10:56, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Coating with Thermal Aluminium (content was: "For non-conductive samples, such as glass or quartz wafers, a charge dissipation layer is required on the top of the E-beam resist, for reduction of electrostatic charging of the surface of the substrate. You can keep the wafers with ZEP...")
10:56, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/TEBN1 (content was: "TEBN1 is a negative tone e-beam writer resist with very high resolution and very low sensitivities. the maximum resit thickness can be achieved by spin coating is 40nm. the typical dose needed for exposure is around 5000µc/cm2</sup...")
10:55, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/SAL601 (content was: "SAL601 is a negative tone, chemical amplified e-beam resist. It has good sensitivity (80µc/cm2 at 100kV). the resolution is around 100nm. Develope: *MF322: 5 to 8 min *Rinse by DI water: 30 sec")
10:55, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/ZEP520A (content was: "ZEP520A belongs to ZEP520 series of e-beam resists. 520 series are high performance positive e-beam resist which show high resolution, high sensitivity and high dry etch resistance. Resists of this series are suitable for various e-beam ...")
10:54, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Develop e-beam resist (content was: "===Zep520A develop=== Standard recipe for developing: # N50, 2min for develop # IPA 30sec for rinse # N2 blow dry or spin dry Note: Zep520A have a large tolerance on development time. for the resist thickness less than 150 n...")
10:54, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/E-beam exposure (content was: "Due to the high maintenance cost, Only the Danchip operators are allowed to loading the cassette to the e beam writer. The starting point is a L-Edit file (*.tba). *The first step is to convert this L-Edit file to *.gds. *Then you ex...")
10:53, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/What resist to choose (content was: "===Positive tone resist=== ZEP520A is the most popular used E-beam resist. It is a positive resist with high resolution (better than 30nm). If you need a negative tone pattern, the normal procedure is to use the lift-off process( with ...")
10:53, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/PMMA (content was: "PMMA950K is a positive tone e beam resist. it has good resolution (better than 20nm), low sensitivity (around 500uc/cm2 at 100kv). peer dry etch resistance (around 3t..." (and the only contributor was "Pxshi"))
10:53, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/E-beaming (content was: "for the e beam lithograph, the users should prepare their pattern data in the gds format. it is then converted either by the software called layout beamer (in the pc at e..." (and the only contributor was "Elk"))
10:52, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography/Lift-off e-beam resist (content was: "==Aluminium lift-off with zep520A resist== Procedure: #After developing the zep520A resist the first step is to deposit aluminium. The best way to do this is by...")
10:50, 1 June 2015 Bghe talk contribs deleted page Specific Process Knowledge/E-beam lithography (content before blanking was: "300x300px|thumb| The JEOL JBX-9500 electron beam lithography system is a spot electron beam type lithography system designed for writing patterns with dimensions from nanometers to sub-micrometers. Th...")
10:22, 28 May 2015 Bghe talk contribs deleted page Multisource PVD (content was: "== New PVD equipment == See further PVD co-sputter/evaporation ''Cyrofox Exployer 700 Flex bought from..." (and the only contributor was "Kn"))
10:14, 28 May 2015 Bghe talk contribs deleted page Specific Process Knowledge/Etch/IBE/IBSD Ionfab 300 (content before blanking was: "='''THIS PAGE IS UNDER CONSTRUCTION'''= ==IBE/IBSD Ionfab 300: milling, dry etching and deposition in the same tool== IBE: Ion Beam Etch IBSD: Ion Beam Sputter Deposition This Ionfab300 from Oxford Instruments is cab...")
10:11, 28 May 2015 Bghe talk contribs deleted page Advanced Silicon Etcher - Pegasus (content was: "SPTS Pegasus user manual can now be found here >HERE< Here you can find some Information on the new STS Pegasus Si Etcher ..." (and the only contributor was "Roycork"))
10:09, 28 May 2015 Bghe talk contribs deleted page III-V Materials ICP Etcher (content was: "SPTS ICP III-V Materials Etcher user manual can now be found here >HERE< Here you can find some Information on the n..." (and the only contributor was "Roycork"))
10:08, 28 May 2015 Bghe talk contribs deleted page Advanced Metal Etcher (content was: "SPTS ICP Metal Etcher user manual can now be found here >HERE< Here you can find some Information on the new STS ICP Metal..." (and the only contributor was "Roycork"))
09:54, 28 May 2015 Bghe talk contribs deleted page Process Specific Knowledge/Photolithography/AZ5214E diluted positive resist (content before blanking was: "#REDIRECT Specific Process Knowledge/Photolithography/AZ5214E diluted positive resist")
09:53, 28 May 2015 Bghe talk contribs deleted page Specific Process Knowledge/Etch/Etch of Silicon Nitride using RIE (content was: "For a general introduction to RIE at Danchip see RIE (Reactive Ion Etch) Etching of silicon nitride using RIE can be done with several recipes. It can be etched by o..." (and the only contributor was "BGE"))
09:52, 28 May 2015 Bghe talk contribs deleted page Components (content was: "== Components== test")
11:54, 27 May 2015 Bghe talk contribs uploaded File:Monthly LabAdviser update 20150527.docx (MsUpload)
08:25, 26 May 2015 Jehan talk contribs deleted page File:Lesker 2014 with text2.jpg (Deleted old revision 20150526072319!Lesker_2014_with_text2.jpg: not possible to make thumbnail)
08:25, 26 May 2015 Jehan talk contribs deleted page File:Lesker 2014 with text2.jpg (Deleted old revision 20150526072447!Lesker_2014_with_text2.jpg: not possible to make thumbnail)
08:24, 26 May 2015 Jehan talk contribs uploaded a new version of File:Lesker 2014 with text2.jpg
08:23, 26 May 2015 Jehan talk contribs uploaded a new version of File:Lesker 2014 with text2.jpg
08:09, 26 May 2015 Jehan talk contribs uploaded File:Lesker 2014 with text2.jpg (Lesker sputter system)
10:29, 22 May 2015 Ziba talk contribs uploaded File:FEI Quanta 200 3D.png
18:59, 12 May 2015 Frsto talk contribs uploaded File:StackedSlices 3.jpg (Frederik PDMS replica molding)
18:58, 12 May 2015 Frsto talk contribs uploaded File:StackedSlices 2.jpg (Frederik PDMS replica molding)
18:47, 12 May 2015 Frsto talk contribs uploaded File:AFM-PDMS BOTH 4.jpg
18:39, 12 May 2015 Frsto talk contribs uploaded File:SEM PDMS 5.jpg (Frederik PDMS replica molding)
18:39, 12 May 2015 Frsto talk contribs uploaded a new version of File:SEM PDMS 4.jpg (Frederik PDMS replica molding)