Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! | ! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni/electrochemical deposition]]) | ||
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| Batch size | | Batch size | ||
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|Only very thin layers (up to 100nm). | |Only very thin layers (up to 100nm). | ||
|Sample must be compatible with plating bath. Seed metal necessary. | |||
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|} | |} | ||