Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium: Difference between revisions
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This QZ plate is bonded to a Si wafer. | This QZ plate is bonded to a Si wafer. | ||
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ '''Cr etch''' | |+ '''Cr etch''' by bghe@danchip | ||
|- | |- | ||
! Parameter | ! Parameter | ||
|'''Cr etch''' | |'''Cr etch''' | ||
|- | |- | ||
! Cl<sub>2</sub> (sccm) | ! Cl<sub>2</sub> (sccm) | ||
Revision as of 12:23, 3 May 2013
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Chromium etch in ICP metal
The Chromium etch has ONLY been carried out on the following substrate stack: The Chromium is sputter deposited onto a 2" quartz wafer and pattered by e-beam with Zep520A resist. This 2" QZ wafer is bonded with crystal bond to a 65mmx65mm quartz plate with the thickness: 6.35mm. This QZ plate is bonded to a Si wafer.
| Parameter | Cr etch |
|---|---|
| Cl2 (sccm) | 65 |
| O2 (sccm) | 15 |
| Pressure (mTorr) | 15 |
| Coil power (W) | 300 |
| Platen power (W) | 15 |
| Temperature (oC) | 50 (no back side cooling) |
| Spacers (mm) | 100 |
| Etch rate (nm/min) | ~14 |
| Zep520A resist selectivity | ~0.9 |
| Comment | . |