Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
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|-style="background:silver; color:black" | |||
! | |||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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*6x6" wafers | *6x6" wafers | ||
|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1µm | |10Å to 1µm | ||
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|. | |. | ||
|- | |- | ||
| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||