Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
No edit summary |
No edit summary |
||
| Line 6: | Line 6: | ||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
! | |||
|-style="background:silver; color:black" | |||
! | |||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
| Line 12: | Line 14: | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
| Line 29: | Line 32: | ||
*6x6" wafers | *6x6" wafers | ||
|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| Line 35: | Line 39: | ||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1µm | |10Å to 1µm | ||
| Line 41: | Line 46: | ||
|. | |. | ||
|- | |- | ||
| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
Revision as of 13:52, 1 March 2013
Feedback to this page: click here
Chromium deposition
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1µm | 10Å to 1000 Å | . |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | Depending on process parameters, see here. |
Studies of Cr deposition processes
Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings
Sputtering of Cr in Wordentec - Settings and deposition rates