Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=/... click here]'''
+== Chromium deposition ==
 Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.
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 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
 |-
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 *6x4" wafers or
 *6x6" wafers
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
 |
 *24x2" wafers or
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 |-
 | Pre-clean
+|RF Ar clean
 |RF Ar clean
 |RF Ar clean
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 |10Å to 1µm
 |10Å to 1µm
+|10Å to 1000 Å
 |.
 |-
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 |2Å/s to 15Å/s
 |10Å/s to 15Å/s
+|About 1Å/s
 |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
 |-