2012 Usage Top list: Difference between revisions
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Tool usage registered in LabManager. For tools which are charged by booking, the amount of time is the booked time. For other tools it is the registered time. <br> | Tool usage registered in LabManager. For tools which are charged by booking, the amount of time is the booked time. For other tools it is the registered time. <br> | ||
Tool usage is part of Danchip's decision making processes for maintenance allocation as well as new acquisitions but by no means the only parameter. <br> | Tool usage is part of Danchip's decision making processes for maintenance allocation as well as new acquisitions but by no means the only parameter. <br> | ||
<table border="1" cellspacing="0" cellpadding="8" table style="margin:auto"> | |||
<tr align="center" style="background:#f0f0f0;"> | |||
<td> <b> Rank </b> </td> | |||
<td align="left"> <b> Tool Name </b> </td> | |||
<td> <b> Usage (hours) </b> </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 1 </td> | |||
<td align="left"> Resist Pyrolysis Furnace </td> | |||
<td> 1545 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 2 </td> | |||
<td align="left"> Electroplating-Ni </td> | |||
<td> 1307 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 3 </td> | |||
<td align="left"> Wordentec </td> | |||
<td> 1012 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 4 </td> | |||
<td align="left"> Hotplate 1 (SU8) </td> | |||
<td> 1011 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 5 </td> | |||
<td align="left"> DRIE Pegasus </td> | |||
<td> 894 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 6 </td> | |||
<td align="left"> Fume Hood(KOH) </td> | |||
<td> 872 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 7 </td> | |||
<td align="left"> EVG NIL </td> | |||
<td> 846 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 8 </td> | |||
<td align="left"> Hotplate 4 (SU8) </td> | |||
<td> 819 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 9 </td> | |||
<td align="left"> Polymer Injection Molding </td> | |||
<td> 763 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 10 </td> | |||
<td align="left"> XPS-ThermoScientific </td> | |||
<td> 738 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 11 </td> | |||
<td align="left"> Sputter-System(Lesker) </td> | |||
<td> 710 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 12 </td> | |||
<td align="left"> SEM Zeiss </td> | |||
<td> 708 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 13 </td> | |||
<td align="left"> KS Aligner </td> | |||
<td> 703 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 14 </td> | |||
<td align="left"> Hotplate 2 (SU8) </td> | |||
<td> 688 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 15 </td> | |||
<td align="left"> RIE2 </td> | |||
<td> 670 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 16 </td> | |||
<td align="left"> E-Beam Writer </td> | |||
<td> 661 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 17 </td> | |||
<td align="left"> BCB Curing Oven </td> | |||
<td> 660 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 18 </td> | |||
<td align="left"> Black Magic PECVD (Carbon) </td> | |||
<td> 637 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 19 </td> | |||
<td align="left"> SSE Spinner </td> | |||
<td> 620 </td> | |||
</tr> | |||
<tr align="center"> | |||
<td> 20 </td> | |||
<td align="left"> KOH3 (4",6") </td> | |||
<td> 609 </td> | |||
</tr> | |||
</table> | |||
Internal Danchip sponsors not included in these totals: Process Develop, Maintenance, QC | |||
Revision as of 15:01, 19 February 2013
Tool usage registered in LabManager. For tools which are charged by booking, the amount of time is the booked time. For other tools it is the registered time.
Tool usage is part of Danchip's decision making processes for maintenance allocation as well as new acquisitions but by no means the only parameter.
| Rank | Tool Name | Usage (hours) |
| 1 | Resist Pyrolysis Furnace | 1545 |
| 2 | Electroplating-Ni | 1307 |
| 3 | Wordentec | 1012 |
| 4 | Hotplate 1 (SU8) | 1011 |
| 5 | DRIE Pegasus | 894 |
| 6 | Fume Hood(KOH) | 872 |
| 7 | EVG NIL | 846 |
| 8 | Hotplate 4 (SU8) | 819 |
| 9 | Polymer Injection Molding | 763 |
| 10 | XPS-ThermoScientific | 738 |
| 11 | Sputter-System(Lesker) | 710 |
| 12 | SEM Zeiss | 708 |
| 13 | KS Aligner | 703 |
| 14 | Hotplate 2 (SU8) | 688 |
| 15 | RIE2 | 670 |
| 16 | E-Beam Writer | 661 |
| 17 | BCB Curing Oven | 660 |
| 18 | Black Magic PECVD (Carbon) | 637 |
| 19 | SSE Spinner | 620 |
| 20 | KOH3 (4",6") | 609 |
Internal Danchip sponsors not included in these totals: Process Develop, Maintenance, QC