Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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Two recipes have been optimized for the ASE: A shallow etch shallolr and a deep etch | Two recipes have been optimized for the ASE: A shallow etch shallolr and a deep etch | ||
deepetch. | deepetch. | ||
{| border="1" cellspacing="1" cellpadding="2" align="left" | |||
! Recipe: | |||
! Shallolr | |||
|- | |||
| SF<sub>6</sub> flow | |||
|32 sccm | |||
|- | |||
|O<sub>2</sub> flow | |||
|8 sccm | |||
|- | |||
|Pressure | |||
|80 mTorr | |||
|- | |||
|RF-power | |||
|30 W | |||
|- | |||
!Phase | |||
!Etch cycle | |||
!Passivation cycle | |||
|- | |||
|} | |||