Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace. In the chart below you can compare the two different deposition methodes: | PolySilicon can be sputtered in Alcatel and be deposited in the PolySilicon furnace. In the chart below you can compare the two different deposition methodes: | ||
| Line 21: | Line 22: | ||
*For other sizes ask the furnace team | *For other sizes ask the furnace team | ||
| | | | ||
*24x2" wafers or | |||
*6x4" wafers or | |||
*6x6" wafers | |||
|- | |- | ||
| Pre-clean | | Pre-clean | ||
| Line 34: | Line 37: | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
|~50Å to 2µm, if thicker layers are needed please ask the furnace team. | |~50Å to 2µm, if thicker layers are needed please ask the furnace team. | ||
| | |10Å to about 3000Å | ||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 56: | Line 59: | ||
|. | |. | ||
|Good | |Good | ||
| | |. | ||
|- | |- | ||
| Line 63: | Line 67: | ||
|. | |. | ||
|Good for fused silica, silicon oxide, silicon nitride, silicon | |Good for fused silica, silicon oxide, silicon nitride, silicon | ||
|. | |||
|- | |- | ||
|Substrate material allowed | |Substrate material allowed | ||
| Line 68: | Line 73: | ||
|Pyrex, fused silica, silicon, metals, oxide, nitride | |Pyrex, fused silica, silicon, metals, oxide, nitride | ||
|Fused silica, Silicon, oxide, nitride | |Fused silica, Silicon, oxide, nitride | ||
| | |Pyrex, fused silica, silicon, metals, oxide, nitride | ||
|- | |- | ||
| Line 75: | Line 81: | ||
|None | |None | ||
|Can be doped during deposition with Boron and/or Phosphorous | |Can be doped during deposition with Boron and/or Phosphorous | ||
| | |None | ||