Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions
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|This recipe is under development due to a high aspect ratio dependent etch rate for very narrow trenceds <100nm | |This recipe is under development due to a high aspect ratio dependent etch rate for very narrow trenceds <100nm | ||
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=== Etching of nanostructures in silicon === | === Etching of nanostructures in silicon === | ||