Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
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| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1µm | |10Å to 1µm | ||
|. | |. | ||
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| Deposition rate | | Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] | |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] | ||