Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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==DRIE-Pegasus== | ==DRIE-Pegasus== | ||
The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. Within each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes). In the passivation cycle, | The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. Within each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes). In the passivation cycle, a C<sub>4</sub>F<sub>8</sub> plasma is formed using the RF coil power only and a teflon-like coating is created on all surfaces and thus protecting the sidewalls in the etch. In the etch cycle the passivation la | ||
Revision as of 20:18, 16 May 2011
DRIE-Pegasus
The DRIE-Pegasus takes the well established Bosch process known from the ASE a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. Within each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes). In the passivation cycle, a C4F8 plasma is formed using the RF coil power only and a teflon-like coating is created on all surfaces and thus protecting the sidewalls in the etch. In the etch cycle the passivation la
Details on DRIE-Pegasus
Further info: