Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]]) | |||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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|E-beam deposition of Pt | |E-beam deposition of Pt | ||
|E-beam deposition of Pt | |E-beam deposition of Pt | ||
|Sputter deposition of Pt | |||
|Sputter deposition of Pt | |Sputter deposition of Pt | ||
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|Ar ion source | |Ar ion source | ||
|none | |none | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
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|10Å - 600nm* | |10Å - 600nm* | ||
|10Å - 600nm* | |10Å - 600nm* | ||
|10Å - ? ''discuss with staff'' | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
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|0.5Å/s to 10Å/s | |0.5Å/s to 10Å/s | ||
|up to 3.74 Å/s | |up to 3.74 Å/s | ||
|''not known yet, probably similar to 'old' Lesker system | |||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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*1x6" wafer | *1x6" wafer | ||
*smaller pieces | *smaller pieces | ||
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*Up to 10x4" or 6" wafers | |||
*Many smaller pieces | |||
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* Metals | * Metals | ||
* Carbon | * Carbon | ||
| Almost any that does not outgas | |||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
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'''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.'' | '''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.'' | ||