Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using AOE: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
No edit summary
Line 1: Line 1:
Danchip has recently (January 2009) taken over the AOE from Hymite. Not much process testing has been done yet.
The AOE was upgraded in the spring 2010 and there has been a lot of problems with it since. It is running now but we still do not at a very good recipe. Ask Berit (BGE) for the resent progress in process development.


<!--
==Etching of micro structures in Silicon Oxide with photoresist or (poly)silicon as masking material==
==Etching of micro structures in Silicon Oxide with photoresist or (poly)silicon as masking material==


Line 256: Line 257:
|-
|-
|}
|}
-->

Revision as of 12:54, 14 October 2010

The AOE was upgraded in the spring 2010 and there has been a lot of problems with it since. It is running now but we still do not at a very good recipe. Ask Berit (BGE) for the resent progress in process development.


Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/Etching_of_Silicon_Oxide/SiO2_etch_using_AOE&oldid=4158"