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Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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Au deposition: removed physimeca
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! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
! Sputter ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) 
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 03|(Sputter coater 03)]]
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 03|(Sputter coater 03)]]
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 04|(Sputter coater 04)]]
! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater#Sputter coater 04|(Sputter coater 04)]]
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| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| E-beam deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
| Sputter deposition of Au
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! Pre-clean
! Pre-clean
|Ar ion source  
|Ar ion source  
|RF Ar clean
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|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
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|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to about 3000 Å **
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|Depends on process parameters, 1-10 Å/s  
|Depends on process parameters, 1-10 Å/s  
|Depends on process parameters
|Depends on process parameters
|5-10 Å/s
|Not measured
|Not measured
|Not measured
|Not measured
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*Up to 10x6" or 4" wafers
*Up to 10x6" or 4" wafers
*Many small pieces  
*Many small pieces  
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*1x 2" wafer or
*1x 4" wafers or
*Several smaller pieces
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*Several smaller samples
*Several smaller samples
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* Almost any as long as it does not outgas - see cross-contamination sheets in Labmanager
* Almost any as long as it does not outgas - see cross-contamination sheets in Labmanager
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* III-V materials
* Silicon wafers
* Quartz wafers
* Pyrex wafers
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* All samples allowed in the SEM Supra 1
* All samples allowed in the SEM Supra 1
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* Takes approx. 12 minutes to load and transfer samples  
* Takes approx. 12 minutes to load and transfer samples  
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* For thicknesses above 200 nm permission is required
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* Used for gold sputter coating of samples before SEM inspection
* Used for gold sputter coating of samples before SEM inspection