Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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m →Comparison of deposition equipment for silver: removed physimeca |
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! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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| Thermal deposition of Ag | | Thermal deposition of Ag | ||
| Thermal deposition of Ag | | Thermal deposition of Ag | ||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
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| Ar ion beam bombardment | | Ar ion beam bombardment | ||
| none | | none | ||
| none | | none | ||
| | | none | ||
| RF Ar clean | | RF Ar clean | ||
| RF Ar clean | | RF Ar clean | ||
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|10Å to 0.5µm ** | |10Å to 0.5µm ** | ||
|10Å to 0.5µm **(0.5µm not on all wafers) | |10Å to 0.5µm **(0.5µm not on all wafers) | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
|10Å to about 2000Å | |10Å to about 2000Å | ||
| Line 70: | Line 66: | ||
|1 to 10Å/s | |1 to 10Å/s | ||
|5Å/s | |5Å/s | ||
|1 to 10Å/s | |1 to 10Å/s | ||
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | |Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | ||
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*6x4" wafers or | *6x4" wafers or | ||
*24x2" wafers | *24x2" wafers | ||
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*6x6" wafers or | *6x6" wafers or | ||
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!Allowed materials | !Allowed materials | ||
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* | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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* | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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* | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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* | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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* | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | *Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | ||
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| Pumpdown approx 15 min. | | Pumpdown approx 15 min. | ||
| Only very thin layers. Pumpdown approx 1 hour. | | Only very thin layers. Pumpdown approx 1 hour. | ||
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