Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride: Difference between revisions
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*[[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|TiN deposition using ALD]]. | *[[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|TiN deposition using ALD]]. | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride/Deposition of Titanium Nitride using Lesker sputter tool|TiN deposition | *[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride/Deposition of Titanium Nitride using Lesker sputter tool|TiN deposition with reactive sputtering using Lesker sputter tool ]]. | ||
==Comparison between sputtering and ALD methods for deposition of Titanium Nitride.== | ==Comparison between sputtering and ALD methods for deposition of Titanium Nitride.== |
Revision as of 13:56, 30 August 2022
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Deposition of Titanium Nitride
Thin films of Titanium Nitride (TiN) can be deposited by either ALD or reactive sputtering. If sputtering is used, the target is Ti and nitrogen (N2) is added as reactive gas to the chamber resulting the formation of Titanium Nitride on the sample. The process information is available below:
Comparison between sputtering and ALD methods for deposition of Titanium Nitride.
ALD2 | Sputter-System Metal-Oxide (PC1)/Sputter-System Metal-Nitride (PC3) | Sputter-System(Lesker) | |
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Generel description |
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Stoichiometry |
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Film Thickness |
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Deposition rate |
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Step coverage |
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Process Temperature |
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Substrate size |
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Allowed materials |
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