Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
|E-beam deposition of Pt | |E-beam deposition of Pt | ||
|E-beam deposition of Pt | |E-beam deposition of Pt | ||
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|Ar ion source | |Ar ion source | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|10Å - 1µm* | |10Å - 1µm* | ||
|10Å to 5000Å* | |10Å to 5000Å* | ||
|10Å to 5000Å | |10Å to 5000Å | ||
|- | |- | ||
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|0.5Å/s to 10Å/s | |0.5Å/s to 10Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|? Å/s to ? Å/s | |? Å/s to ? Å/s | ||
|- | |- | ||
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*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
| | | | ||
*1x4" wafer or | *1x4" wafer or | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
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* Silicon | * Silicon | ||
Revision as of 13:23, 3 October 2021
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Platinum deposition
Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Temescal) | E-beam evaporation (Wordentec) | Sputter deposition (Lesker) | ||
|---|---|---|---|---|
| General description | E-beam deposition of Pt | E-beam deposition of Pt | Sputter deposition of Pt | |
| Pre-clean | Ar ion source | RF Ar clean | RF Ar clean | |
| Layer thickness | 10Å - 1µm* | 10Å to 5000Å* | 10Å to 5000Å | |
| Deposition rate | 0.5Å/s to 10Å/s | 10Å/s to 15Å/s | ? Å/s to ? Å/s | |
| Batch size |
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| Allowed materials |
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| Comment | As of August 2018, Pt has not yet been deposited in the Temescal.
Please contact the Thin Film group to develop a process. |
* If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.